PART |
Description |
Maker |
SSM6E03TU |
Multi-chip discrete device (P-ch N-ch)
|
TOSHIBA
|
HN2E04F |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation Toshiba Semiconductor
|
SKY77601 |
Multi-Mode, Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets
|
Skyworks Solutions Inc.
|
SKY77601 |
Multi-Mode Multi-Band Power Amplifier Module
|
Skyworks Solutions
|
TQP9058H-15 |
Multi-Mode / Multi-Band Power Amplifier Module
|
TriQuint Semiconductor
|
AS8S512K32AQ1-25L_Q AS8S512K32P-17L/IT AS8S512K32P |
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 PGA-66 512K x 32 SRAM SRAM MEMORY ARRAY
|
Micross Components Austin Semiconductor
|
PQ05R01 PQ05R02 PQ05R03 PQ05R04 PQ09R04 PQ12R02 PQ |
Multi Functional Regulator Module MULTI-FUNCTIONAL REGULATOR MODULE RF/Coaxial Connector; RF Coax Type:BNC; Contact Termination:Crimp; Body Style:Right Angle Plug; RG Cable Type:59, 62, 140, 210, Belden 8241, 8263, 8279, 9209 RoHS Compliant: Yes 多功能稳压模
|
Sharp List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
|
XE3301I XE3301F XE3301G |
Multi-national 33,600 BPS modem module. Italy. Multi-national 33,600 BPS modem module. France. Multi-national 33,600 BPS modem module. Germany.
|
XECOM
|
WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP 1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119 1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
BMXDDI1602 |
discrete input module M340
|
List of Unclassifed Man...
|
SSM5H11TU |
Silicon N Channel MOS Type (U-MOS3)/Silicon Epitaxial Schottky Barrier Diode Multi-chip discrete device (N-ch SBD)
|
Toshiba Semiconductor
|